| Image | Part Number | Manufacturer | Description | Series | Current Rating | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 225791-6 | Agastat Relays / TE Connectivity | CONN SOCKET CONTACT COAX SIZE5 | ARINC | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | Coaxial | - | |
| 533082-9 | Agastat Relays / TE Connectivity | CONN PIN GUIDE FOR PLUG PLATED | HDI (High Density Interconnect) | - | Bulk | - | - | Gold | 30.0µin (0.76µm) | Power | - | |
| 09060009571 | HARTING | DIN-POWER CRIMP 2 M PL2 EINZEL | DIN 41612 | - | Bulk | - | - | - | - | Signal | - | |
| 598489050000040 | AVX Corporation | DIN CONN | 8489 | - | Bulk | - | - | Gold | - | - | - | |
| 1766273-1 | Agastat Relays / TE Connectivity | CONTACT PIN #0 | - | - | Bulk | - | - | Silver | 200.0µin (5.08µm) | Power | - | |
| 09030006161 | HARTING | DIN-SGNL COAX M SLD/CRIMP 50OHM | DIN 41612 | - | Bulk | - | - | - | - | Coaxial | - | |
| 1738009-1 | Agastat Relays / TE Connectivity | PIN CONT,SIZE 22,W/REDUCED CRIMP | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | - | - | |
| 1663533-2 | Agastat Relays / TE Connectivity | PIN CONTACT SZ20 REAR POSTED | ARINC 600 | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | Power | - | |
| 1766274-1 | Agastat Relays / TE Connectivity | CONN PIN #0 INT THREAD | ELCON | 200A | Bulk | - | - | Silver | 200.0µin (5.08µm) | Power | - | |
| 225790-2 | Agastat Relays / TE Connectivity | CONN PIN COAX SIZE 5 CABLE 142 | ARINC | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | Coaxial | - |
Contacts in backplane connectors are the conductive elements responsible for establishing electrical connections within the connector system. These contacts are designed to ensure reliable and low-resistance connections, facilitating the transmission of signals or power between mated connectors. The quality and precision of contacts play a critical role in the overall performance and durability of backplane connectors in diverse electronic applications, including servers, data storage systems, and communication devices.