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Backplane Connectors - Contacts
Backplane Connectors - Contacts
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- Connectors, Interconnects
- Backplane Connectors - Contacts
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Packaging | Mounting Type | RoHS Status | Contact Finish | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1648777-1 | Agastat Relays / TE Connectivity | CONN POWER CONTACT PCB MNT | - | - | - | - | Bulk | - | - | Gold | 30.0µin (0.76µm) |
|
|
205547-2 | Agastat Relays / TE Connectivity | PIN SZ 20 - SPECIAL | ARINC 404 | - | - | - | Bulk | - | - | Gold | - |
|
|
6-192042-6 | Agastat Relays / TE Connectivity | LA4S,.290,.004 UNPL | - | - | - | - | Bulk | - | - | - | - |
|
1857417-2 | Agastat Relays / TE Connectivity | CONTACT - POWER PIN #2 | - | - | - | - | Bulk | - | - | Silver | 196.9µin (5.00µm) |
|
09060009554 | HARTING | DIN-POWER CRIMP 1 M PL1 SINGLE | DIN 41612 | - | - | - | Bulk | - | - | - | - |
|
1766188-1 | Agastat Relays / TE Connectivity | CONN PIN #12 CRIMP SILVER | - | - | - | - | Bulk | - | - | Silver | 200.0µin (5.08µm) |
|
105-060-202-200 | EDAC Inc. | CONNECTOR - PRINTED CIRCUIT | 105 | - | - | 10A | Bulk | - | - | Gold | - |
|
030-2410-003 | Cannon | CONN CONTACT BUMP 24-26AWG GOLD | DL | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) |
|
123C10019X | Conec | HIGH POWER CONTACTS SOLDER PIN | - | - | - | 40A | - | - | - | Gold | 31.5µin (0.80µm) |
|
|
6648433-1 | Agastat Relays / TE Connectivity | CONTACT, SOCKET, SIZE #12 | - | - | - | - | - | - | - | - | - |
About Backplane Connectors - Contacts
Contacts in backplane connectors are the conductive elements responsible for establishing electrical connections within the connector system. These contacts are designed to ensure reliable and low-resistance connections, facilitating the transmission of signals or power between mated connectors. The quality and precision of contacts play a critical role in the overall performance and durability of backplane connectors in diverse electronic applications, including servers, data storage systems, and communication devices.