Invent, Innovate, Integrate
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Loading products…
| Image | Part Number | Manufacturer | Description | Voltage Rating - DC | Voltage Rating - AC | Series | Operating Temperature | Features | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| FCS0H473ZFTBR24 | KEMET | CAP 47MF -20% +80% 5.5V SMD | - | - | FC | -25°C ~ 70°C | - | Tape & Reel (TR) | Surface Mount | - | - | |
| EEC-S0HD223H | Panasonic | CAP 22MF -20% +80% 5.5V T/H | - | - | SD | -25°C ~ 70°C | - | Bulk | Through Hole | - | - | |
| EEC-A0EL105 | Panasonic | CAP 1F -20% +80% 2.5V T/H | - | - | AL | -25°C ~ 70°C | - | Bulk | Through Hole | - | - | |
| JUMT1225MPD | Nichicon | CAP 2.2F 20% 2.7V THROUGH HOLE | - | - | EVerCAP® JUM | -25°C ~ 70°C | - | Bulk | Through Hole | - | - | |
| EEC-S0HD224VN | Panasonic | CAP .22F 5.5V T/H | - | - | SD | -40°C ~ 70°C | - | Bulk | Through Hole | - | - | |
| HVZ0E107NF-LT | KEMET | SUPERCAP 100F 30% 2.7V 10MM LEAD | - | - | HVZ | -25°C ~ 60°C | - | Bulk | Through Hole | - | - | |
| SCCU25E256MRB | AVX Corporation | CAPACITOR 25F 20% 3V T/H | - | - | SCC | -40°C ~ 65°C | - | Bulk | Through Hole | - | - | |
| EDLSD223H5R5C | Cornell Dubilier Electronics | CAP 22MF 5.5V THROUGH HOLE | - | - | SD | -25°C ~ 70°C | - | Bulk | Through Hole | - | - | |
| DSK-3R3H703T414-HLL | Elna America | CAP 70MF -20% +80% 3.3V SMD | - | - | DSK | -10°C ~ 70°C | - | Cut Tape (CT) | Surface Mount | - | - | |
| SCCR12E105SRB | AVX Corporation | CAPACITOR 1F -10% +30% 3V T/H | - | - | SCC | -40°C ~ 65°C | - | Bulk | Through Hole | - | - |
Electric Double Layer Capacitors (EDLC), commonly known as supercapacitors, are energy storage devices with high capacitance values and rapid charge-discharge capabilities. These capacitors find applications in backup power systems, regenerative braking in vehicles, and electronic devices requiring quick bursts of energy. Supercapacitors complement traditional batteries by providing a high-power-density solution.