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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Capacitance | Pitch - Connector | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RFS0J470MCN1GS | Nichicon | CAP ALUM POLY 47UF 20% 6.3V SMD | FPCAP, RFS | -55°C ~ 105°C | Tape & Reel (TR) | Surface Mount | - | - | 47µF | - | - | |
| RSA0G331MCN1GS | Nichicon | CAP ALUM POLY 330UF 20% 4V SMD | FPCAP, RSA | -55°C ~ 105°C | Cut Tape (CT) | Surface Mount | - | - | 330µF | - | - | |
| 108AVG016MGBJ | Illinois Capacitor | CAP ALUM POLY 1000UF 20% 16V T/H | AVG | -55°C ~ 125°C | Bulk | Through Hole | - | - | 1000µF | - | - | |
| 2R5SEP680M+TSS | Panasonic | CAP ALUM POLY 680UF 20% 2.5V T/H | OS-CON™, SEP | -55°C ~ 105°C | Tape & Box (TB) | Through Hole | - | - | 680µF | - | - | |
| 187ULG016MFH | Illinois Capacitor | CAP ALUM POLY 180UF 20% 16V T/H | ULG | -55°C ~ 105°C | Bulk | Through Hole | - | - | 180µF | - | - | |
| 2R5SEPC820M+TS | Panasonic | CAP ALUM POLY 820UF 20% 2.5V T/H | OS-CON™, SEPC | -55°C ~ 105°C | Tape & Box (TB) | Through Hole | - | - | 820µF | - | - | |
| 827UVR2R5MFE | Illinois Capacitor | CAP ALUM POLY 820UF 20% 2.5V SMD | UVR | -55°C ~ 105°C | Bulk | Surface Mount | - | - | 820µF | - | - | |
| EEF-CX0G221XR | Panasonic | CAP ALUM POLY 220UF 20% 4V SMD | SP-Cap CX | -55°C ~ 105°C | Tape & Reel (TR) | Surface Mount | - | - | 220µF | - | - | |
| RNU1A122MDN1 | Nichicon | CAP ALUM POLY 1200UF 20% 10V T/H | FPCAP, RNU | -55°C ~ 105°C | Bulk | Through Hole | - | - | 1200µF | - | - | |
| A700V476M006ATE028 | KEMET | CAP ALUM POLY 47UF 20% 6.3V SMD | AO-Cap A700 | -55°C ~ 125°C | Cut Tape (CT) | Surface Mount | - | - | 47µF | - | - |
Aluminum-polymer capacitors are a type of electrolytic capacitor that uses a conductive polymer as the electrolyte. These capacitors offer improved performance over traditional aluminum electrolytic capacitors, including lower ESR and longer operational life. They are commonly used in power electronics, servers, and high-performance electronic systems.